On August 15, 2012, the FilltheGap Hardship Scholarship was established to assist students that discover an immediate need to fill an unexpected “gap” that exist between the cost of attendance and their expected family contribution. Fill the Gap, according to SEPA, Inc.’s founder Thomas G. Hicks, Sr., a former financial aid officer, “is a term of art used by financial aid professionals. On many occasions colleges fail to meet the complete financial need of a student, leaving the student with an unmet need (a gap). To address this need, the foundation established this scholarship to help students.
To apply for a FilltheGap Scholarship, a student sends an email request to fillthegap@sepaincorp.com and briefly explains their need. Unlike the Goldsmith Rinzler Williams Scholarship, a student is not require to attend a HBCU or HSI to apply. Students should note that the FilltheGap scholarship will generally be awarded to students that need help paying for books or mandatory fees. Eligible students seeking “tuition” assistance should apply for a Goldsmith Rinzler Williams scholarship. The vision of the foundation is to help students pay for books or mandatory fees. FilltheGap scholarships have ranged from $260 to $580, and all requests for scholarships were granted in 2012 and 2013 school years. Students attending Chowan University, Loyola University, the Pennsylvania State University, University of Texas, and University of Maryland Eastern Shore have received FilltheGap scholarships. The next round of scholarships will be awarded in August for the fall semester.
Donations to the SEPA Education Foundation, a 501(c)(3) non-profit organization, can be sent to P.O. Box 18783, Baltimore, Maryland 21206 or made electronically. 100% of the funds donated to the foundation goes towards scholarships.
